Day 1
| Electromagnetics: Connectors | |
|---|---|
| Topic | Presenter |
| MODSIM – Advanced Multiphysics Simulation of a Smartphone Connector -> REPLAY | Dawood NULWALLA, Dassault Systèmes |
| Simulation and measurement of transfer impedance of HV-connector systems -> Abstract | Antoine VAN PEER, Hirschmann Automotive GmbH |
Signal integrity analysis of coaxial connectors using CST Studio Suite -> Abstract | Ali ARSHADI, Technia GmbH |
| Electromagnetics: Antenna | |
|---|---|
| Topic | Presenter |
| New simulation based magnetic antenna for Hearing Aids -> REPLAY | Thomas FISCHER, WSAudiology |
| Tunable Liquid Chrystal Filter -> REPLAY | Ersin POLAT, Dassault Systèmes |
| Design of 3D Antenna using Evolutionary Algorithms -> REPLAY | Stanislav KOVAR, Tomas Bata University in Zlin |
| Coverage and Channel Simulation in a Complex Industrial Environment -> REPLAY | Marc RÜTSCHLIN, Dassault Systèmes |
Day 2
| Electromagnetics: EMC I | |
|---|---|
| Topic | Presenter |
| Design and validation of a simulation methodology for the virtual evaluation of magnetic fields on component level -> Abstract | Marcel MESSER, Audi AG |
| CST 2023 Recent Enhancement on EMC Simulation -> REPLAY | Richard SJIARIEL, Dassault Systèmes |
| Conducted emission simulation on complex steering system -> REPLAY | Dávid SZERENCSÉS, thyssenkrupp Components technology Hungary Kft. |
| Electromagnetics: EMC III | |
|---|---|
| Topic | Presenter |
| Electrostatic Particle-In-Cell Simulation for Analysis of Initiation of Insulator Surface Flashover in Vacuum -> Abstract | Svetlana GOSSMANN, Siemens AG |
| Macromodeling for EMC Simulations -> REPLAY | Andreas BARCHANSKI,, Dassault Systèmes |
| Modeling and validation of a vibrating intrinsic reverberation chamber for immunity testing on vehicle level -> Abstract | Timo KAISER |
Structure: Optimization | |
|---|---|
| Topic | Presenter |
| Enabling Radar Sensor Vehicle Integration by electromagnetic simulations -> Abstract | Yadhu KRISHNAN M K, Continental AG |
| Radar Sensor Integration into Vehicles using 3DEXPERIENCE Platform -> REPLAY | Jan EICHLER, Dassault Systèmes |
| Machine-Learning Models of Components in Electromagnetic Compatibility -> REPLAY | Jan HANSEN, Graz University of Technology |
Day 3
| Electromagnetics: Compute on 3DX & EDA | |
|---|---|
| Topic | Presenter |
| Simulation of large scale EM-problems on the 3DEXPERIENCE Cloud -> REPLAY | Frank DEMMING-JANSSEN, SIMUSERV GmbH |
| Power integrity simulations in the Pre-Layout design phase | Oleksandr TALALAEVSKYY, Continental Automotive GmbH |
| Misleading EM-Decoupling rules in PCB-design -> REPLAY | Joachim HELD, Siemens AG |
| Modeling and Simulation of a DDR5 Prototype -> REPLAY | Longfei BAI, Dassault Systèmes |
| 3D printed electronics and its ramification on the electronics design process -> REPLAY | Rolf BALTES, J.A.M.E.S. GmbH |
