Abstract –

This paper presents the design of an Equilateral Triangular Microstrip Patch Antenna (ETMPA) operating at 28 GHz for 5G communication applications. The antenna employs an inset-fed technique, and its performance is evaluated using both CST Studio Suite  and HFSS simulation tools. A Taconic TLX-9 substrate with a thickness of 0.1638 mm is used, while the patch conductor is implemented with pure copper and gold to investigate the effect of conductor material on radiation performance.

Simulation results demonstrate that the proposed compact antenna, with a volume of approximately 4.59 mm³, exhibits excellent and consistent performance. The optimized design achieves the following parameters: return loss () of –44.4 dB, VSWR of 1.0121, radiation efficiency of 98%, directivity of 6.06 dB, and gain of 5.96 dB. Moreover, the comparison between pure copper and gold patch conductors reveals nearly identical results, confirming the reliability of the design regardless of conductor type.

A close agreement is also observed between CST and HFSS outcomes, with CST generally producing slightly superior results compared to HFSS and to previously reported experimental and theoretical works at 28 GHz. Overall, the proposed antenna design provides significant size reduction while maintaining high radiation efficiency, making it a strong candidate for 5G communication systems.

Keywords: Microstrip Antenna, Return Loss, Pure Copper, Gold, 5G, Bandwidth, Gain, Wireless Communication Systems.