Abstract

Accurate thermal simulation of printed circuit boards (PCBs) is essential for ensuring reliable electronic designs. This presentation explores the verification process of CST Studio Suite for PCB thermal analysis. The focus is on identifying the key adjustments needed to achieve consistency between simulation results and experimental measurements.

The study examines how material properties and mesh settings influence the accuracy of thermal simulations. Different parameter configurations were tested to determine the optimal setup that aligns the simulation output with real-world data. The impact of solver settings is also evaluated.

The findings provide insights into the capabilities and limitations of CST Studio Suite in predicting PCB temperatures. By following a structured verification approach, we demonstrate how simulation accuracy can be improved, making CST Studio Suite a reliable tool for thermal analysis in PCB design.

Slide deck

Presenter Bio

Ondrej Stejskal is a simulation expert at Valeo. He holds an M.Sc. in radio-electronics from the Czech Technical University in Prague. His expertise lies in high frequency applications and EMC/EMI simulation. As a team leader, he specialized in Frequency Modulated Continuous Wave (FMCW) automotive radar technology. As a technical expert, he is specializing on EMC aspects of the Advanced Driver Assistance Systems (ADAS) in Valeo Brain Division.