Abstract

Rosenberger is active in the automotive market, connectivity for datacentres, mobile communications and semiconductor test. We see a strong trend that product designs fully exploit the maximum stress levels allowable to the material. This implies that knowledge of the residual margin for stress in the product is essential. In order to achieve precise results, an accurate material database is a must.
Die-casting, injection moulding, stamp-and-form technology are key to serve the market in volumes and to bring the product cost down.

We will have a walk-through the required portfolio of simulation disciplines and discuss, to what degree virtual prototyping may reduce lead times and cost. Things get complicated as even a "simple" connector has to be treated as a multiphysical system, requiring suitable tools for the virtualized experimenting. The presentation will include various examples of simulation such as electromagnetic transmission in waveguides, EMC considerations, coupled EM-thermal problems for high-frequency as well as high-power transmission and the modeling of mechanical stress like mating forces. 

For the future, we expect that complete development phases will rely completely on virtual prototyping. Credibility of simulation results therefore is a key factor for success. Closing the feedback loop from simulation results to test data is a must, leading to some kind of "calibration" of the simulation disciplines. In the future, we see that democratisation of simulation technology, and virtual project workspaces will bring additional efficiency to the development process.
 

Slide deck

Presenter Bio

Michael Wollitzer currently holds the position as VP R&D at Rosenberger Hochfrequenztechnik. He holds a Masters' degree and a PhD in electrical engineering from Technische Universität München. Before joining Rosenberger, he was with Daimler Research in Ulm, working on mmW-radar sensors and mmW imaging.

At Rosenberger, he worked in the fields of microelectromechanics, signal- and power integrity, very high speed datalinks for automotive and datacentre-applications. In general, he sees the integration of numerical simulation techniques in the design flow as key to minimize cost and lead times in the development process.

His current focus is on how to bring together CAD, numerical simulation and lab tests.