As the cost associated with smaller technology nodes increases substantially, semiconductor companies are increasingly looking to:

• Facilitate innovation in package design as high performance packages are a critical component that helps semiconductor companies keep pace with Moore’s law.
  
• Ensure thermo-mechanical reliability of IC packages as premature failures can cost billions of dollars in warranty costs, recalls, brand damage etc. Interconnects, thru silicon vias are prone to thermo-mechanical fatigue.
  
• Reduce material costs per unit while satisfying the reliability requirements as even minor savings per unit can add up to many millions in cost savings for high volume product lines such as ICs.
  
• Reduce overall design time by automating repetitive tasks and converge to best designs faster by using parametric studies, design of experiments and optimization
  

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Speakers

@MR 

Semiconductor Industry Solution Experience Director, DASSAULT SYSTÈMES

Manuel Rei joined Dassault Systèmes in 1986. He held various positions of responsibility in the development of DS solutions dedicated to the Electronics industry. Manuel brings over 30 years of experience supporting Dassault Systèmes’ global customers in high-tech and automotive markets. He also lived 3 years in the USA, as Project Manager in charge of Dassault Systèmes High Tech Industry Solutions deployment within several IBM divisions, working actively on the Mechatronics Systems Design area. Since 2011, he is in charge of the High Performance Semiconductor Solution Experience, dedicated to the lifecycle management of a semiconductor. Prior to joining Dassault Systèmes, Manuel Rei held a design engineering position in Valeo Climate Control division, working on several vehicle projects from several Automotive OEMs, such as BMW, Volkswagen, Audi, Mercedes-Benz, Peugeot, Renault and others.