Electromagnetics | EuroCentral RUM 2026

EMC

TopicPresenter
Enhancement of 3D model fidelity using micro-CT scans Vratislav SOKOL, Rohde & Schwarz
3D modeling of Inductcive components Yukinobu MASUDA, Murata Electronics Europe
Validation of Virtual EquipmentMarc REINHARDT, ZF Active Safety GmbH
Comparison of Stripline Configurations for component level EMC Emission Measure-ments: Impedance Matching, Loss Mechanisms and Practical Considerations  Dávid SZERENCSÉS, thyssenkrupp Components Technology H Kft.
Shielding effectiveness simulation of a metal housing  Rajeev MALHOTRA, Diehl Aerospace GmbH
3D EM Co-Simulation for RF Immunity Prediction in ASIC Sensors up to 8 GHz Suresh Kumar YENUMULA, ams-OSRAM GmbH
EMC Immunity Analysis in Automotive IC System Design through Statistical Classification (Abstract) Simon PROFANTER, Graz University of Techology
Uncertainty Quantification for Virtual BCI Testing: A CST-Based Workflow for Robust Sensor EMC Design Yvonne SPAECK-LEIGSNERING, Robert Bosch GmbH

Multiphysics

Antenna

TopicPresenter
Design and Fabrication of a Compact In-Phase Elliptical Waveguide Divider Optimized for 3D Printing  Frederike BARTELS, TU Hamburg
Design and Integration of a Generic Dual-Band WiFi Antenna for Solder-In Modules in Home Appliance (Abstract)  Ibrahim ELABYAD, BSH Hausgeräte GmbH
From Analytical Pre-Design to Full-Scale 3D Analysis of Aerospace Radomes: Validating Transmission Line Approaches via Floquet Port Unit Cell Modeling in CST Studio Suite  Sebastian SCHEITLER, Airbus Defence and Space GmbH 
Python-Based Hardware Performance Evaluation for Simulia CST Studio Suite  Frank DEMMING-JANSSEN & Felix WINTERGERST, Simuserv GmbH  
Optical simulations of metasurfaces supporting photonic bound states in the continuum Michael HIRLER, LMU Munich 
Simulation of optical absorption in nanoporous gold: the role of dangling-ligament resonances Salman WAHIDI, TU-Hamburg   

General Topics

TopicPresenter
EMAG on HPC and DS Cloud: Infrastructure, Licensing & Performance Karthikeyan SUKUMAR, Dassault Systèmes
Virtual Twins in Automotive EMC Peter BIRKEFELD, ZF Active Safety GmbH
Update EMAG R&D Leonardo SASSI, Dassault Systèmes

EDA

TopicPresenter
EDA: SI and PI on high density multilayer PCBs with CST Studio PCBS Hendrik SACHSE, Diehl Aerospace GmbH
A "story" of LPDDR5 simulation Stefanie SCHATT, Aumovio Germany GmbH
Time-Domain Eye Construction for MIPI C-PHY using Full-Wave Electromagnetic Modeling Julnar MUSMAR SOLIS, Aumovio Germany GmbH