I have an off topic question that I am hoping the users here can help me with.

I am looking for an epoxy, potting compound or adhesive that can survive the following thermal cycle.

Process   Bake @ Temp C    Time (min.)

Pre Bake  150                120

Cure       180                135

Pre Bake  150                 120

Cure        90                105

Cure       170                140

Bake      125                240

Cure       175                280

Bake      138                300     

Reflow    225                  1

This is a 24 hour curing cycle.  The product will see this cure cycle once a week.

What might I be able to use to secure some small magnets into an aluminum carrier?

Thanks,

Anna