I have an off topic question that I am hoping the users here can help me with.
I am looking for an epoxy, potting compound or adhesive that can survive the following thermal cycle.
Process Bake @ Temp C Time (min.)
Pre Bake 150 120
Cure 180 135
Pre Bake 150 120
Cure 90 105
Cure 170 140
Bake 125 240
Cure 175 280
Bake 138 300
Reflow 225 1
This is a 24 hour curing cycle. The product will see this cure cycle once a week.
What might I be able to use to secure some small magnets into an aluminum carrier?
Thanks,
Anna
SolidworksGeneral