Dear All,

We have a power electronics issue in which we have to consider the transient thermal behavior of the Power MOSFETs and the cooling effect of their environment (heat sink, PCB, etc.). We have the thermally extended SPICE model of power MOSFETs and would like to attach it to the 3D model. I have seen an application note (v2015) which is about the electrical-thermal co-simulation, but I cannot find those "thermal" components in CST Design Studio (see attachment). Has anybody used them or has an idea how to find them? The online help also mentions them, but it seems that these components are missing from the CST Studio Suite 2020.

Thank you in advance