We were honored to have Nikolay Osipov from Transvalor present at the SIMULIA Americas Users Conference, May 3-4, 2023 in Novi, Michigan.
Abstract: Transvalor is a software and engineering services company. Transvalor offers an extensive portfolio of high-performance simulation software that addresses a wide range of industrial applications from forming processes (FORGE@, COLDFORM@ THERCAST@, SIMHEAT@) for metallic solid and liquid materials to structural analysis and lifetime estimation (Z-SET SUITE). Our simulation software brings significant scientific, engineering and modeling know-how to a number of industries (Aerospace, Automotive, Energy.. )
In addition to its headquarters in France, Transvalor is present worldwide thanks to its subsidiary and its very dense network of distributors who provide both sales and assistance functions. The American market and customers are served through Transvalor Americas Corp, located in Chicago.
Since 1996 Transvalor commercializes Z-mat for Abaqus - a library of constitutive models for plasticity and viscoplasticity with robust integration methods and advanced coefficient identification procedures. The actual package of integrated solutions provided by TRANSVALOR helps customers to solve challenges ranging from material modeling and parameters' calibration to fatigue life estimation and 3D crack growth simulations.
In our talk we will go through the presentation of the Z-set products and their interfaces with Abaqus and provide examples of applications to industrial problems. A particular focus will be given to the 3D fracture analysis tool Z-cracks and crack propagation simulations.
Bio: Dr. Osipov has 15 years of experience in FE modeling and material behavior simulations. He received his Master Degree in Applied Mechanics from the St. Petersburg Polytechnic University, Russia and his Doctorate at the Ecole des Mines in Paris, France. Since 2007 Nikolay has been working at Transvalor to develop and commercialize Z-set software. Current topics of Nikolay's interests are material behavior simulation, durability analysis and crack propagation.
