Abstract

ASICs are highly-specific devices that are designed for a particular function, that allow the achievement of outstanding performances. However, the design and manufacturing of ASICs is very expensive due to the non-recurring engineering needed, including the time for simulations, prototyping, testing and fabrication. Furthermore, the design and development process generally involves a lengthy design cycle that is not compatible with the time-to-market. The need for small, compact and highly integrated devices with a cost-effective strategy and faster time-to-market is pushing the space market competitors to find new solutions for space application devices. In this frame, the introduction of System-in-Packages is allowing a high level of heterogeneous integration with a lower cost and time-to-market.
This presentation covers the use of 3DS CST for the design of mixed signals (High-speed, Microwave) transitions to be use in space applications SiPs. The simulations take into account the need to design a package substrate that can survive in harsh environments, such as space, and an overview of how its testing is performed is also discussed. 

Slides

Speaker

After taking a master's degree in Electronic Engineering at the University of L'Aquila (L'Aquila, Italy), he started working at Thales Alenia Space in Italy as a Process Engineer in the Electronics Technology and Processes department, mainly focusing on the evaluation of substrates, components and assembly technologies for space applications. He is also a member of the Technology R&D group, involved in several research projects that evaluate new substrates and components.

@A 
Process Engineer / R&D

Thales Alenia Space Italia