When designing high-speed serial channels, engineers often find that multi-GB/s signals behave much in the same way as RF signals and that the three-dimensional structure of the transmission channel (vias, reference planes, connectors, and so on) becomes important. High-fidelity 3D electromagnetic simulation has been used in the design process by RF engineers for decades, and the same techniques can also be used to model high-speed serial channels.

With this eSeminar, learn about:

• How to use 3D electromagnetic simulation at all stages in the design flow.
• How to optimize reference plane changes and make early stage design decisions such as layer stackup, via backdrilling, or trace separation that are difficult to change at a later stage
• What to do when not all components of the transmission channel are under the control of the sign-off engineers and high-fidelity simulation models of those components can be hard to come by

Watch the eSeminar: