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Too hot to handle

Modern devices with high-speed processors and compact form factors can get hot and uncomfortable to hold. In addition, overheating adversely affects device performance and can cause damage. By studying worst-case scenarios using thermal simulation, the heat can be managed and dissipated without causing damage. Thermal simulation can be coupled to electromagnetic simulation to
calculate heating, and to fluid simulation to model airflow through the device to ensure efficient heat dissipation and cooling.