While AM technologies can produce part which is both lighter and stronger than counterparts produced by traditional methods, effectively utilizing these design freedom is not trivial.Tosca Structure is used to perform topology optimization to determine an optimum material distribution in a defined design area while accounting for existing constraints to the design space: boundary conditions, fixations and pre-tensions, and loads.

Considering the average cost to send 1 pound of material into space today is close to \\\$10,000, light-weighting these circuit boxes is a critical design objective. In collaboration with Stratasys, we conducted a topology optimization design study with the intent of printing these new concepts with the Fused Deposition Modeling (FDM) process.

The STL generated from Tosca structure can be used to create a parameterized CAD using 3DEXPERIENCE for further parametric optimization of the design.

Using the new Representation Volume Element (RVE) plugin to obtain homogenized properties of various lattice using periodic boundary conditions. These properties is used to optimize the lattice design as well as infill percentage.

Optimizing the print parameters is key to reduce the overall cost of the printing process. A 'quick' AM process simulation is developed to  be used for optimizing the process parameters e.g. print speed, orientation using Isight.

If you are interested to learn more about these topics please take a look at the recording of the e-seminar.

https://swym.3ds.com/#media:118173

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