As part of the R2026x FD02 user assistance, SIMULIA R&D created a 3DEXPERIENCE tutorial that teaches you how to define volume conditions for a printed circuit board (PCB) to analyze its thermal performance. To perform the steps in this tutorial, you use the Fluid Scenario Creation and Physics Results Explorer apps.
While completing this tutorial, you learn how to:
- Enable e-cooling for the air around the PCB and for the heat-generating chips on it.
- Define the PCB volume condition, which includes its conductor and dielectric materials and a table specifying the thickness and conductor volume fraction for the PCB layers.
- Specify stopping criteria and run the simulation.
- Plot contours for the temperature results to visualize the distribution of heat on the board.
You can apply these principles to your own model and scenario.
To try this tutorial yourself, see E-Cooling of a Printed Circuit Board.
Thank you to @Avinash JAMMALAMADAKA, @David BROWN, @Chris HODGE, and Benjamin RAHMING for all their effort in bringing this tutorial to life!
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