About a decade ago several advanced creep models were added to Abaqus for modeling the creep of lead-free solder.  At first they were added as "built-in" creep user-subroutines, then later as native and fully documented models. These are the Double-Power, the Anand, and the Darveaux creep models.
 

There was a nice Knowledge Base article written to disseminate this information:
 

And a nice Tech Brief:
 

In 2011, several of my SIMULIA colleagues wrote a NAFEMS paper about the calibration of the Modified Anand creep model for lead-free solder.  The paper focused on the calibration of the creep models using Isight running Abaqus unit-cube models.  Table 1 of their paper gives a quick summary of all the Anand model parameters (taken from a 2004 paper by Chen, Chen and Sakane on SN-3.5AG lead-free solder).   When we added the Anand model to the 3DX Material Calibration app, we used these parameters as the default initial parameters.  Recently I used those parameters (with E=50GPa and Poisson's ratio=0.40) to generate a series of synthetic test data across the strain-rates and temperatures shown  in Figure 2 of that paper. 

 In R2021x FD05 and earlier versions of the Calibration app, there is a typo in the default initial value of the A3 parameter.  It is supposed to be  -3260581.8 MPa×s  but is incorrectly in the software as  1,000 times too small.

The zip file below contains the NAFEMS paper, a unit-cube Abaqus input file used to generate the synthetic data, and an Excel file containing the synthetic data.

Reference paper, 2004 IEEE, Inter Society Conference on Thermal Phenomena

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