As part of the R2025x FD02 user assistance, SIMULIA R&D updated a 3DEXPERIENCE example that teaches you how to define and run a simulation that determines the heat dissipation from a fan-cooled central processing unit (CPU) board. In this example, you define a fluid flow simulation using a geometry-based volume definition, and you then model the heat transfer from the CPU chip to a heat sink via the air flowing away from the fan. To define, run, and evaluate this simulation, you use the following apps:
- Geometry Idealization Essentials
- Fluid Scenario Creation
- Physics Results Explorer
While completing this example, you learn how to create a conformal volume for use in a fluid simulation. You then learn to define physics domains and assign material properties to regions of the CPU board model. Next, you learn how to use and define thermal conditions to specify the CPU chip as the heat producer. To define the fan apparatus, you learn how to use a fan inlet boundary condition that allows you to import supplied volume flow rate and pressure jump data. After running a simulation that predicts the fan-induced airflow through the CPU board, you review temperature and flow results to determine the fan performance.
You can use what you learn in this example to leverage geometry-based volume definitions in your own fluid flow simulations.
To try this example yourself, see Conjugate Heat Transfer in a Fan-Cooled CPU Board
Thank you to @JJ and @AJ for all their effort in bringing this example to life!
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The 3DEXPERIENCE Simulation Examples Team would like to hear your ideas for new examples. If you have an idea, please leave a comment below so that the team can contact you. The team also welcomes feedback on any of its existing examples.
