We were honored to have Rick Knoechel from AMD present at the SIMULIA Americas Users Conference, May 1-2, 2024 in Novi, Michigan.
Abstract
HPE and AMD share a common goal with Simulia in helping customers solve simulation challenges by delivering highly efficient, best-in-class high-performance computing clusters, storage, and data management solutions. Our enterprise CAE customers are having regular discussions around thermal and power management when considering their next-generation HPC cluster. Liquid cooling is an important technology to consider as it can have a significant positive impact on their thermal management strategy. It also aligns with ambitions of using high thermal design power (TDP) AMD processors that may otherwise be performance limited with air cooling. HPE and AMD’s joint presentation is intended to help Abaqus customers make knowledgeable and sustainable choices regarding their selection of high-performance computing (HPC) hardware to optimally run Abaqus FEA software from the SIMULIA brand of Dassault Systèmes.
Presenters
Rick Knoechel is Global Strategy Lead for Automotive and Discrete Manufacturing for the Data Center Server BU at AMD. Prior to his current role, Rick was AMD’s Public Cloud HPC lead for all aspects of CAE HPC across all Industry Verticals. Rick joined AMD in October of 2021 after stints with Oracle Cloud Infrastructure (OCI) and Rescale.
Well versed in all aspects of Scientific HPC and General IT, Rick has worked for IT Industry leaders over the past 20+ years including time with Dell, EMC, NetApp, and IBM’s Platform Computing.
Tony DeVarco started his career in technology at Silicon Graphics, Inc. in 1999. He is currently Director, HPC and Manufacturing Vertical at Hewlett Packard Enterprise. For over 10 years, Tony has been responsible for all aspects of HPE’s HPC and Manufacturing vertical business development activities which includes its GTM strategy, sales training, competitive market analysis, ISV partner ecosystems management and CAE workflow solution enablement.
