SIMULIA partner, DfR Solutions, has announced their latest Sherlock version release.

As a board-level reliability tool, Sherlock enables fast integration of package level and board level information by incorporating Printed Circuit Board (PCB) properties, package material parameters, and lead geometries into finite element models. This tool facilitates a collaboration between finite element analysis and physics of failure (PoF) degradation models, which culminate in reliability predictions that contribute to optimal lifetime performance. With the advance of technology and the need for smaller designs, system-level effects become more apparent due to the higher density and power dissipation of electronics. Sherlock’s Thermal-Mechanical Analysis provides the ability to capture system-level influences on solder joint reliability during temperature cycling. Understanding the interactions due to mirroring, over-constrained boards, and potting/staking assures a more robust PCB under thermo-mechanical stresses.

Learn more by downloading Thermal-Mechanical Analysis with Sherlock 5.3.