RUM2021 RUM2021-NAM CustomerPresentation
Structural adhesives are widely used in many industries, including the automotive, aerospace, and electronics industries. To properly design bonded structures and products, the chemical shrinkage and residual stresses associated with the curing process of the adhesive must often be understood. In this presentation a finite element-based method for simulating curing processes is outlined. In this method a coupled thermal-structural analysis featuring user-defined subroutines is used to predict chemical conversion using the temperature-dependent reaction kinetics associated with the adhesive, and to calculate the temperature and conversion-dependent evolution of chemical shrinkage, thermal expansion, heat generation, and mechanical properties. The experimental methods required to characterize these dependencies will also be discussed, as well as the testing performed to validate the curing model. Finally, a native Abaqus implementation of the cure modeling procedure will be introduced.
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