Last days to register on 

https://events.3ds.com/3dexperience-modeling-and-simulation-conference

Plenary session’s speakers include:

- Clifton Davies, from Lockheed Martin on "3DEXPERIENCE platform Process Composer Apps for Multi-Disciplinary Optimization on EXPEDITE"

- @PL, CATIA; @DH, SIMULIA; @GC, ENOVIA on "Modeling and Simulation in the Age of Digital Transformation"

- Laurent Tournier, HEOL Composites and @PM, Dassault Systèmes on "On the Road to Olympic Games: From Md-Sim Optimization of a Composite Mast for Racing Application"

- R. Byron Pipes, Purdue University, on "Simulation as the language of Innovation - 3DEXPERIENCE"

- Jeswin Joseph C , NIAR - Allan Zhong, PhD, Halliburton, on 'Composite sUAS Simulation, Validation and Manufacturing on the 3DEXPERIENCE platform"

- Hansong Huang, Amcor, on "Driving Innovation in Sustainable Packaging"

Breakout session’s inlcude

- Keith Meintjes, CIMdata

- Chris Philpott and Shyam Sundar Balasubramanian, Knust Godwin

- Abriham Pasumarthy and Rajasekaran Mohan, Detroit Engineering Product

- Christopher Greiner and Berhooz Shahidi, Ford

- Luis Gomez, NIAR

- Jim Reed, VIAS

- Jifa Mei, American Axle and Manufacturing

- David Branscomb, PhD, Highland Composites

- Gagliano, Charlie, Honda

- Shanaka Ranatunga, Goken

- @RR ​​​​​​​@EA ​​​​​​​@JL ​​​​​​​@JE ​​​​​​​@AI ​​​​​​​@SK ​​​​​​​@MB ​​​​​​​@BA ​​​​​​​@RB ​​​​​​​@FL ​​​​​​​@CD ​​​​​​​@DP ​​​​​​​@JA ​​​​​​​@JC ​​​​​​​@GD ​​​​​​​@TY ​​​​​​​@CC ​​​​​​​@GF ​​​​​​​@PL ​​​​​​​@GA 

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3DXCONFERENCE ​​​​​​​