Session Details
Speaker(s): Ritupriya Bobhate
Date: February 04, 2026
Video Recording
Presentation Slides
Session Abstract
This presentation highlights a simulation-driven workflow for validating Signal Integrity (SI), Power Integrity (PI), and thermal performance in high-speed PCB with SOLIDWORKS geometry. This session demonstrates how to perform SI analysis for high-speed interfaces (impedance control, crosstalk, eye diagrams), PI analysis for robust power distribution networks (DC drop, impedance profiling, decoupling optimization), and thermal simulation for component temperature and heat-flow management and countering strategies for all three..
By pre-validating SI, PI, and thermal behavior at both pre- and post-layout stages, designers can identify risks early, reduce hardware re-spins, and improve overall system reliability. The demo illustrates how simulation enables engineers to optimize PCB designs efficiently and accelerate time-to-market.
