Functional Value

Reduce time to meet thermal performance and power consumption targets of electronics assemblies with the new Parametric Design Study app by easily launching an automated design exploration to simulate a large number of alternatives and quickly identifying the best performing designs.

Faster turnaround time for capturing thermal response of electronics cooling assemblies using reduced-order flow and thermal modelling to mimic behavior of electronics cooling components such as heat pipes, perforated plates, 2-resistor compact package models and blowers