[SIMULIA] Fluid Dynamics Engineer

Functional Value

Reduce time to meet engineering performance targets with the new Parametric Design Study app by easily launching an automated design exploration to simulate a large number of alternatives and quickly identifying the best performing designs.

Faster turnaround time for capturing thermal response of electronics cooling assemblies using reduced-order flow and thermal modelling to mimic behavior of electronics cooling components such as heat pipes, perforated plates, 2-resistor compact package models and blowers

I
Reduce time to meet engineering performance targets with the new Parametric Design Study app by easily launching an automated design exploration to simulate a large number of alternatives and quickly identifying the best performing designs.

I
Faster turnaround time for capturing thermal response of electronics cooling assemblies using simplified thermal modeling (not related to geometry) in flow scenario to mimic behavior of electronics cooling components