I have a mpcb from top to down:
heat source
copper track
0,1mm dielectric polymer (0,2W/mk)
1,5 mm thickness aluminum
the manufacturer says is an equivalent to 2W/mk but I don't think is a realistic Simulation.
How usually you simulate the MPCB? do you consider every layer ?
the Interface resistance of the polymer is easy to simulate with the relative function, but I cannot put two interface thermal resistance one on top other for the copper track.
How usually you do it?
SolidworksFlow Simulation